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Company Background
Ultra Communications was founded in 2005 as a spin-out
of Peregrine Semiconductor. We are a team of engineers
that developed multi-Gbps, multi-channel transceivers
since the year 2000. We have talents covering all
aspects of photonic component development, manufacturing
and qualification.
Company Management
Charlie Kuznia, Ph. D. - Chief
Executive Officer & President
22 years of experience in the areas of integrated
optoelectronic/VLSI systems, free-space and fiber optic
interconnects.
Joe Ahadian, Ph. D. - Chief
Technology Officer & Vice President Engineering
18 years of experience in the design of high-speed
mixed-signal circuits, with major designs including TIAs, laser drivers, PLLs, clock-recovery circuits,
VCOs, high-linearity low-noise broadband amplifiers, RF
switches, and RF power amplifiers.
Richard Pommer - Chief Operations
Officer & Vice President of Operations
41 years of experience managing interconnect packaging
projects from initial concept into pilot production for
commercial and military applications.
Richard Hagan - Chief Information
Officer & Vice President of Design
33 years of experience in advanced design engineering
for high reliability components, including high density
interconnects, optical components and ASIC packaging.
Experience in implementing quality control systems and
creating qualification plans.
Chuck Tabbert - Chief of Business
Development & Vice President Sales and Marketing
23 years technical and management experience spanning
several Space & Defense semiconductor providers.
Facilities
UltraComm maintains a 2,000 sq. ft. class 1000 clean
room with ESD controls, including humidity. With an
automated 8” wafer test system, and automated fiber
optic module test station, UltraComm has photonic
assembly & test capabilities (50 GHz scopes, 5 Gbps
BERTs) on-site. UltraComm also maintains environmental
test chambers, including a EPIC thermal cycle/shock
camber for stressing optical modules through
qualification. In 2010, we added precision
flip-chip bond capability (FineTech
Semi-Automatic Fineplacer Lambda Die Bonder with 0.5
micron placement accuracy).
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