Ultra Communications

We supply photonic components for harsh environment applications, such as satellites, military airframe, UAV, missiles and cellphone base-station applications.

We have developed a hybrid IC and optoelectronic integration approach that features:

	Wafer-scale planar manufacturing of photonic packages
	ASIC integration of transmitters, receivers and built-in-test
	High speed digital (12.5 Gbps) or RF photonic
	Top down optical connector for ribbon fiber
	Operation over a wide temperature range and radiation
	Integrated Built-In-Test for In-Line Measurement:
	* OTDR with 1 cm resolution * Optical power level (average and amplitude) * Voltage level (signal and power supply) * Laser characteristics - operating conditions

We specialize in challenging engineering tasks: high-speed mixed-signal circuit design, packaging for high fidelity electrical and optical coupling, and testing at the wafer and component level.

End applications are primarily 8b/10b encoded data networking for short distance links (< 500 meters), such as Gigabit Ethernet, Fibre Channel, PCIe, Rapid I/O, Infiniband, SATA, SAS, XAUI, USB 3.0, etc.

Learn more about our products

Evaluation kits are now available for our transceiver
ASICs (single channel and quad at 12.5G per channel), OTDR ASIC and 2.5 G CORE devices. Please Contact us for more information.

March 4, 2012
Ultra Communications completes top-down connector development.
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February 3, 2012
Ultra Communications completes verification testing of OTDR and 12.5 Gbps per channel transceiver ASICs.
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November 3, 2011
Ultra Communications awarded Phase I SBIR programs to field high-resolution OTDR in avionic and shipboard systems.
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