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Ultra Communications has
developed a unique photonic packaging approach
that combines optoelectronic devices (such as
VCSELs, PINs) with transceiver ASICs and lenses using flip-chip bonding. The
result is an extremely compact, low-cost, and
robust component for optical communications. We
have demonstrated fiber based and free space
optical interconnects (board-to-board) with this
technology. The arrangement enables the optical
measurement of each VCSEL channel through an
integrated photodector, allowing for wide
temperature range operation and built-in test
functionality.
Ultra Communications also designs custom
mixed-signal ASICs in CMOS, BiCMOS (SiGe) and
Silicon-on-Sapphire processes. |
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The CORE is a sealed
sub-component that can be placed into PCB
assembly to form a full transceiver. The
CORE is manufactured with passive alignment thru
accurate flip-chip bonding. The elements
that make up a CORE are all wafer-scale
fabricated components that are flip-chip bonded
(aligned passively) offering a low cost, rugged
solultion. |
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VCSEL
flip-chip attached to the Integrated Circuit
(view through the sapphire substrate). The
flip-chip process can align VCSEL (or PIN)
devices to lenses with 1 micron accuracy. |
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