/ Avionics
Compact Rugged High-Speed Optical Transceivers
High-speed digital and RF active optics in the industry’s most compact ruggedized reflow solderable MIL-Spec chip-scale package platform
Built to withstand extreme shock and vibration
Operates over wide temperature ranges
SMT reflow solderable with removable connector




/ SPACE
Compact Rad-hard Rugged High-Speed Embedded Optical Modules
High-speed digital and RF Rad-hard embedded optical modules with removeable Rad-hard fiber optic cables
Wide operating temperature range with long lifetimes
Rad-hard and rugged
High I/O density
/ LAND
Compact Rugged High-Speed Optical Transceivers
High-speed digital and RF active optics in the industry’s most compact ruggedized reflow solderable MIL-Spec chip-scale package platform.
Built to withstand extreme shock and vibration
Operates over wide temperature ranges
SMT reflow solderable with removable connector




/ Maritime
Compact Rugged High-Speed Optical Transceivers
High-speed digital and RF active optics in the industry’s most compact ruggedized reflow solderable MIL-Spec chip-scale package platform.