/ Our Products
Ultra Communications
We design, develop and manufacture high-speed embedded optical
transceivers for harsh environment applications. Weâve developed a unique packaging
platform that enables products smaller in size, lower in weight and power (SWaP) than those
currently available for harsh environments. This new micro-optical chip-scale-package platform
(uOCSP) delivers unmatched levels of performance, lifetime and reliability while also providing
a future-proof path to higher speeds, greater channel counts and higher levels of integration –
in an identical package footprint. The uOCSP products are reflow solderable â attach directly to
a host PCB â and interface to UltraCommâs patented removable RVCON connector for optical
cable termini. These compact rugged high-speed optical transceivers are built using
UltraCommâs unique sub-micron planar flip-chip assembly processes and provide the above
attributes at a scale and I/O density not possible with standard packaging platforms.
/ performance
The CSP Platform
From a performance standpoint, the CSP platform offers many advantages to standard optical
transceiver package formats. By directly attaching to a host PCB, the products allow for a low
thermal resistance path, from sensitive laser device to PCB heat sink, resulting in wide
operating temperature range, longer lifetime and higher device reliability. Furthermore, this
methodology provides an efficient electrical interface, between module and PCB, leading to
improved high-speed signal performance which in turn, results in improved optical
performance. This same attachment methodology, results in substantial improvements in
mechanical robustness accomplished through the moduleâs BGA solder interface and
subsequent structural underfill between module and PCB. And, the ability to apply high volume
manufacturing techniques, such as automated pick-and-place and SMT reflow solder processes,
results in lower landed costs for the manufacture and assembly of the higher-level assembly in
which the modules are employed.
/ Ability
Our Transceivers
The ability of UltraCommâs transceivers to operate in the harshest environments including high
shock and vibration, large thermal excursions and thermal cycling, radiation and condensing
atmospheres to name a few, is all the more remarkable for a product with removable
termination/connector. The removable connector capability is enabled by UltraCommâs
patented RVCON (Rugged Vertical CONnector) connector. The RVCON is part of a kinematic
system whereby the RVCON interfaces to the CSP lens guide which aligns the optics and fibers
in the RVCON connector to the collimating lenses in the CSP transceiver module. The kinematic
system, created by the RVCON/lens guide interface, and the mechanical mounting of the
RVCON to the module with a custom spring enables optical alignment to be maintained,
between connector and module, over wide temperature excursions and the high shock and
vibration forces found in many harsh environments such as avionics, space and terrestrial
defense applications.
Have Questions? We are Here to Help You!
We design, develop and manufacture the most compact rugged high-speed fiber optic components for harsh environments on the planet.